"Silicon sawing waste treatment by electrophoresis and gravitational settling", Journal of Hazardous Materials, 526-530, SCI, 2011/05/01

"Modified sedimentation system for improving separation of silicon and silicon carbide in recycling of sawing waste", Separation and Purification Technology, 16-20, SCI, 2011/03/01

"Electrochemical investigations for copper electrodeposition of through-silicon via", Microelectronic Engineering, 195-199, SCI, 2011/02/01

"Removal of metal impurities from cutting slurry waste using a modified electrokinetic system", Fresenius Environmental Bulletin, 99-103, SCI, 2011/01/01

"Iron Removal during Recovery of Silicon from Sawing Waste by Applying Magnetic Field", Separation Science and Technology, 702 - 707, SCI, 2011/01/01

"Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques", Journal of Micromechanics and Microengineering, 115023, SCI, 2010/11/01

"Acetic acid and phosphoric acid adding to improve tantalum chemical mechanical polishing in hydrogen peroxide-based slurry", Microelectronic Engineering, 174-179, SCI, 2010/02/01

"Pretreatment of recycling wiresaw slurries—Iron removal using acid treatment and electrokinetic separation", Separation and Purification Technology, 24-29, SCI, 2009/06/01

"Metal Removal from Silicon Sawing Waste using the Electrokinetic Method", Journal of the Taiwan Institute of Chemical Engineers, 1-5, SCI, 2009/01/01

"Effect of Organic Acids on Copper Chemical Mechanical Polishing", Microelectronic Engineering, 2790-2798, SCI, 2007/12/01

"電化學技術在半導體銅製程中的應用", 化工技術, 95-111, ELSE1, 2007/04/01

"Adding Polyethylene Glycols to Enhance the Electrochemical Planarization of Copper-Plated Wafer", Northern Taiwan Journal, 106-115, ELSE1, 2006/11/01

"Effects of Nonionic Surfactants on Performance of Copper Chemical Mechanical Polishing", Chemical Engineering Communications, 702-714, SCI, 2006/06/01

"Wet etching mechanisms of ITO films in oxalic acid", Microelectronic Engineering, 536-541, SCI, 2006/03/01

"Organic Acid Mixing to Improve ITO Film Etching in Flat Panel Display Manufacture", Journal of The Electrochemical Society, C86-C90, SCI, 2006/01/01

"Glycolic Acid in Hydrogen Peroxide-Based Slurry for Enhancing Copper Chemical Mechanical Polishing", Microelectronic Engineering, 193-203, SCI, 2005/04/01

"Effects of Added Surfactants on Chemical Mechanical Polishing in Nano-Alumina Slurries", Kung Wu Journal, 93-103, ELSE1, 2004/11/01

"A Study of Copper Chemical Mechanical Polishing in Urea-Hydrogen Peroxide Slurry by Electrochemical Impedance Spectroscopy", Applied Surface Science, 120-135, SCI, 2003/05/01

"Localized Corrosion Effects and Modifications of Acidic and Alkaline Slurries on Copper Chemical Mechanical Polishing", Applied Surface Science, 190-205, SCI, 2003/04/01

"TiO2/SiC複合薄膜對304不鏽鋼的光電陰極保護", 台灣鍍膜科技協會年會暨科技部專題計畫研究成果發表會, 台北, 2018/10/12

"Photoelectrochemical Anticorrosion by Using Indium Oxide and Titanium Dioxide", Global Conference on Engineering and Applied Science (GCEAS), TOKYO, 2018/07/10

"於PET薄膜上化鍍銀與鍍液添加劑之研究", 2017台灣化學工程學會64週年年會暨科技部化工學門成果發表會, 台北, 2017/11/17

"Photoelectrochemical Anticorrosion of a TiO2 Coating for Metal", 2017台灣化學工程學會64週年年會暨科技部化工學門成果發表會, 台北, 2017/11/17

"Reduction of Silicon Slurry Waste by Innovative Processes", International Conference on Innovation and Management, Osaka, 2017/07/04

"Hydrogen energy produced by the recovered silicon from wafer-sawing waste", 2016化工年會暨成果發表會, 桃園, 2016/11/25

"Purification of the Recycled Glycol Liquids", 2016化工年會暨成果發表會, 桃園, 2016/11/25

"矽泥廢料回收物應用於電催化觸媒製作與其氧化醇類之特性研究", 第三十四屆台灣觸媒與反應工程研討會暨兩岸綠色催化學術研討會, 臺北, 2016/06/27

"A study on bromine half-cell for redox flow batteries", 「台灣化學工程學會62周年年會暨科技部化工學門成果發表會」與「2015台韓日三國化工聯合會議」, 高雄, 2015/11/05

"Recovery of Nanosilver from Si-Wafer Manufacturing Wastes", 66th Annual Meeting of the International Society of Electrochemistry, Taipei, 2015/10/04

"Preparation of high-performance methanol electrooxidation catalysts with the recovered materials from silicon slurry waste", the 7th International Conference on Green and Sustainable Chemistry (GSC-7) and 4th JACI/GSC Symposium, Tokyo, 2015/07/05

"自矽晶切割廢料中回收高分子型切割液", 2015中華民國高分子研討會, 台北, 2015/01/30

"以沉降法自矽晶切割廢料中回收矽", 2014化學工程學會年會暨科技部化工學門成果發表會, 桃園, 2014/12/12

"資源化晶圓封裝鍍鎳廢液之研究", 2014化學工程學會年會暨科技部化工學門成果發表會, 桃園, 2014/12/12

"資源化矽泥廢料之切割液回收", 2014中國冶工程學會103年年會, 台北, 2014/10/16

"Electrochemical Surface Treatment of Indium Gallium Zinc Oxide Films", 2nd International Symposium on Anodizing Science and Technology (AST2014), Sapporo, 2014/06/04

"利用沉降程序回收矽泥廢料中的切割液", 2013台灣化學工程學會60週年年會暨國科會化學工程學門成果發表會, 台北, 2013/11/22

"矽導通孔鍍銅液中抑制劑的開環劣化研究", 2013台灣化學工程學會60週年年會暨國科會化學工程學門成果發表會, 台北, 2013/11/22

"利用不同多元醇製作直接甲醇燃料電池之鉑/碳陽極觸媒", 2013台灣化學工程學會60週年年會暨國科會化學工程學門成果發表會, 台北, 2013/11/22

"Metal removal from silicon cutting wastewater by microorganisms", 2nd Water Research Conference, Singapore Expo, 2013/01/20

"改良式沉降單元回收矽晶切割廢料中之矽和碳化矽", 2012台灣化學工程學會59週年年會暨國科會化學工程學門成果發表會, 台中, 2012/11/23

"Separation of Metal Impurities from Silicon Sawing Waste", the 14th Asia Pacific Confederation of Chemical Engineering, Singapore, 2012/02/21

"Recycling Silicon from Sawing Waste by Sedimentation in Applied Electrical and Magnetic Fields", IUMRS-ICA 2011 12th International Conference in Asia, Taipei, 2012/01/19

"Electrochemical techniques for the study of high-aspect-ratio copper-electrodeposition", The 6th International Conference on MicroManufacturing (ICOMM), Tokyo, 2011/03/07

"利用電化學技術將矽泥純化為太陽電池矽原料", 99年中國材料科學學會年會, 高雄, 2010/11/19

"Electrochemical planarization of copper in phosphoric acid", The 7th Asian Conference on Electrochemistry (ACEC), Kumamoto, 2010/05/18

"Solar-Grade Silicon Recovery from Wiresaw Waste Using an Electric Field", 4th Asian Conference on Electrochemical Power Sources, Taipei, 2009/11/08

"電場輔助矽切割廢料中矽與碳化矽之分離", 第四屆資源工程研討會, 台北, 2009/09/10

"Electropolishing of Indium Tin Oxide in Oxalic and Tartaric Acid", Active-Matrix Flatpanel Displays and Devices (AM-FPD 09), Nara, 2009/07/01

"Iron Removal from Silicon Wiresaw Slurries", 2008 Taiwan/Korea/Japan Chemical Engineering Conference and 55th Taiwan Institute of Chemical Engineers Annual Conference, Taipei, 2008/11/22

"Electropolishing Mechanisms of Copper-Plated Wafer in Phosphoric Acid", Chemical Engineering Annual Meeting, Tao-Yuan, 2007/11/22

"Electrochemical Planarization of Copper-Plated Wafer in Phosphoric Acid", The Electrochemical Society 211th Meeting, Chicago, 2007/05/01

"Electrochemical Impedance Spectroscopy of Copper during Electrochemical Polishing", Chemical Engineering Annual Meeting, Kaohsiung, 2006/11/22

"The Chemical Mechanical Polishing of Ta Barrier and Its Electrochemical Characteristics", Chemical Engineering Annual Meeting, Miaoli, 2005/11/22

"The Study on Planarizing Copper Thin Films by Electrochemical Polishing", Chemical Engineering Annual Meeting, Miaoli, 2005/11/22

"Electrochemical Action between Cu and Ta/TaN Barrier during CMP", Chemical Engineering Annual Meeting, Tainan, 2004/11/22

"Corrosion Action between Cu and Ta/TaN Barrier during CMP", The Electrochemical Society 206th Meeting, Hawaii, 2004/10/03

"Electrochemical Impedance Spectroscopy of Copper during Chemical Mechanical Polishing in Urea-H2O2 Slurries", Chemical Engineering Annual Meeting, Taipei, 2003/11/22

"Effects of Added Various Surfactants on the Properties of Alumina Slurries", 2003 Annual AICHE Meeting, San Francisco, 2003/11/10