瀏覽人次: 3119071
基本資料   
黃乾怡 教授
Jay Huang
聯絡資料 實驗室連結: 電子信箱: jayhuang@ntut.edu.tw
聯絡電話:無
現職 臺北科大/工業工程與管理系
授課資訊 連結
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期刊論文   
  • "Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process", Journal of Intelligent Manufacturing, 2291-2305, SCI, 2019/06/01
  • "A digital image processing model for characteristics capture and analysis of irregular electronic components", The International Journal of Advanced Manufacturing Technology, 4309-4318, SCI, 2019/06/01
  • "Using Parametric Design to Reduce the EMI of Electronics Products — Example of Medical-Grade Touch Panel Computer", Progress In Electromagnetics Research C, 13-26, SCI, 2019/01/01
  • "Applying Strain Gauges to Measuring Thermal Warpage of Printed Circuit Boards", Measurement, 239-248, SCI, 2017/11/01
  • "Applying Monte Carlo Simulation to Analyze the Open Scenario in the Assembly of Electronic Components", Transactions on Components, Packaging and Manufacturing Technology, 1911-1919, SCI, 2017/08/01
  • "Improve Electromagnetic Interference of Electronic Products with Taguchi Parametric Design", Measurement, 200-207, SCI, 2017/05/01
  • "Improve Electromagnetic Compatibility of Electronic Products with Multivariate Parametric Design—a Case with Panel PC", Microelectronics International, 45-59, SCI, 2017/01/01
  • "Dynamic Parametric Design and Feasibility Assessment for a High Resistance Measuring System", Measurement, 42-49, SCI, 2016/10/01
  • "A grey-ANN approach for optimizing the QFN component assembly process for smart phone application", Soldering & Surface Mount Technology, 63-73, SCI, 2016/02/01
  • "Innovative parametric design for environmentally conscious adhesive dispensing process", Journal of Intelligent Manufacturing, 1-12, SCI, 2015/02/01
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研討會論文   
  • "Intelligent Failure Analysis for Electronics Device Using Red Ink Dye Stain Testing", ICSEM 2019: 4th International Conference on Smart Engineering Materials, Auckland, New Zealand, Auckland, 2019/03/09
  • "Application of TRIZ Theory to Solving Problems in Product Research and Development - Case Study of Probe Card Tester", ICCAIRO 2017: International Conference on Control, Prague, 2017/05/20
  • "Encapsulation Process Study and Yield Model for Smart Phone Manufacturing", Asia Pacific Industrial Engineering And Management Conference-APIEM, 台北, 2016/12/07
  • "ntegration of Kano Model and QFD for Service Quality Improvement", Business and Social Sciences Research Conference, London, 2016/04/11
  • "Lifetime Assessment of Cloud Service Products Based on RMA Data – Taking KVM Switch as an Example", 11th Annual International Conference on Information Technology & Computer Science, 雅典, 2015/05/18
  • "運用TRIZ於電子元件重工製程研發", 2015年系統性創新研討會, 台北, 2015/01/17
  • "整合TRIZ發明原則與演化趨勢於產品研發之問題解決-以電子防潮櫃為例", 2015年系統性創新研討會, 台北, 2015/01/07
  • "An Integrated Approach of Kano Model, Importance-Performance Analysis and TRIZ Inventive Principles for Improving the Education Quality", 2014 ISTS Asian Conference, 台北, 2014/11/17
  • "Systematic Innovations for Optimization of Distribution Center Operations – Example of Russian Post", 2014 ISTS Asian Conference, 台北, 2014/11/11
  • "DOM Products: Activation Energy Estimation and Reliability Assessment", 2013 the 2nd International Conference on Mechanical Engineering, Materials Science and Civil Engineering, Beijing, 2013/10/25
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專書著作   
  • "Quality Control", InTech - Open Access, Austria, European Union, ISBN:978-953-307-329-3, 出版日期:2011/07/01
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專書論文   
  • "Chapter: Materials Assessment and Process Characterization for Lead-Free Soldering", InTech - Open Access, ISBN:978-953-51-1140-5, 出版日期:2013/06/01
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